IR Emitter Wafer Dicing

Application:  There a many industries that design custom microelectronic circuits using specialized substrates tailored to their specific applications.  In this particular application,  devices are printed on Steatite wafers and delivered to CiDRA® Precision Services, LLC to be diced into individual components, then singulated and packaged. 

Features:  The challenge with this application is that thin steatite wafers are rarely flat, but the devices must be diced to better than 25um accuracies.  The development for one customer led to new processes to handle warped wafers, which we use in many other applications.